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Wafer Mapping
Identify semiconductor performace across a wafer.
See Also: Wafer, Mapping, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Probes, Wafer Probers, Wafer Inspection, Wafer Maps
- Scientific Test, Inc.
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Automated Discrete Semiconductor Tester (ATE)
5000E
Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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DUV-NIR Spectroscopic Reflectometry
FilmTek 2000
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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kSA Scanning Pyro
For use on Veeco K465i and EPIK700 MOCVD reactors, the kSA Scanning Pyro performs automated temperature mapping in order to measure temperature variations across wafer carriers and wafers. Use it to tune heater zones and optimize process and hardware to achieve higher yields, wafer uniformity and device performance.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Epi Thickness & Composition System
Element
The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Semiconductor Technology, Micro Scriber + Meters For Contact Angle And Surface Tension
SURFTENS WH 300
Optik Elektronik Gerätetechnik GmbH
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.New: with SECS/GEM Interface!
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Bow and Global Film Stress Measurement
128 Series
Bow and Global Film Stress Measurement.Non-contact full wafer stress mapping for semiconductor and flat panel application.Dual Laser Switching Technology.
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Motion Control Components
- Control of versatile robotic structures, including "yaw", "pitch" and "roll" motion capabilities- S-curve velocity profiling, based on polynomial splines and Bernstein-Bezier curves- Continuous path control in multi-segment smooth trajectories- Synchronization of multiple axes- Trajectory control with user defined velocity profiles- Kinematical modeling of open and closed loop mechanisms- Singularity consistent path planning and singularity avoidance- Optimal PID filter tuning- Automatic adjustment with respect to the surrounding equipment (cassettes, process stations, etc.)- Tilting capabilities in terms of the end-effector frame- Compensation for deflection of the end effector, the manipulated object and geometric in accuracies of the arm Scanning and Aligning Features- Wafer mapping based on through-beam or reflective sensors- Automatic detection of the planarity and the center of wafers and FPD- Non contact FPD aligning. Misalignment compensation on the fly Safety- Programmable travel limits- Position tracking error detection- Amplifier overload protection- Emergency stop
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Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Pressure Mapping
NIP PRESSURE MEASUREMENT SYSTEM
A completely wireless system for measuring nip pressure between rollers in real-time
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Pressure Mapping
BPMS
Measure pressure distribution between the human body and support surfaces such as seats, mattresses
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Pressure Mapping
TIRESCAN
Complete pressure imaging system for conducting tire tread analysis.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Compact Wafer Transport with Integral Wafer Pre-Aligner
GB4P
The GB4P Robot System with integral wafer pre-aligner is the most compact robot and pre-aligner package available on the market today for wafer handling applications up to 200mm, standard payload and throughput.Identical in size to Genmark’s original GB4 robot, the GB4P houses a built-in pre-aligner for wafers ranging from 2"- 8" in diameter. The adjustable feature on the pre-aligner allows for simple and fast configuration for different wafer sizes. Engineered for single or dual wafer transport, the GB4P robot is available with an extensive variety of reach and vertical stroke combinations.
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Professional Mapping Drone
eBee Plus
eBee Plus system includes: long-flying fixed-wing airframe; photogrammetry-optimised RGB sensor; next-gen flight & data management software . The eBee Plus can map more square kilometres per flight. The eBee Plus includes built-in RTK/PPK functionality that can be activated either out of the box or later when required. The eBee Plus offers a camera to suit every application, including the senseFly S.O.D.A. (supplied), the first camera designed for photogrammetric drone mapping.
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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200mm Wafer Sorter
SortMax200™
Achieve exceptional performance with Genmark's SortMax200™ wafer sorter, designed for handling wafers up to 200mm. The SortMax200™ can be configured to accommodate a maximum number of eight open cassette stations.
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2D/3D Wafer Metrology System
7980
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
