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Solder Paste Measurement
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Inspection
- Valhalla Scientific Inc.
product
Rugged Igniter Tester With Current Monitor And Single Connection For Measurement And Charging
4314 KVM
The Valhalla Scientific Model 4314 KVM Digital Igniter Tester is designed to provide extremely safe and reliable resistance testing of explosive or volatile devices. Proven uses include fuses, squibs, igniters, explosive bolts, automobile airbag initiators and many others.
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Printing / Squeegee Force
CmPrint
Measurement of the Force-Time Curve while Printing. The first step into the manufacturing of electronic printed circuit boards (PCBs) is printing. The solder paste is printed on the PCB using a stencil. The equal distribution of the paste pressure is crucial and affects the overall quality of the finished circuit board. An important influencing factor is the accuracy and reproducibility of the squeegee force.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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PXIe Measurement Accelerator
M9451A
The M9451A PXIe Measurement Accelerator combined with Option DPD Digital Pre-Distortion & Envelope Tracking Gateware shows what is possible when you combine state of the art FPGA's with Keysight's trusted measurement expertise and PXIe's high speed data handling. As part of Keysight's RF PA/FEM Characterization & Test, Reference Solution, this combination provides unprecedented performance for demanding envelope tracking and digital pre-distortion measurements required for testing modern power amplifiers (PAs) and front-end modules (FEMs). Hardware acceleration provides better than 20x speed improvement over Keysight's previous host-based Reference Solution, with closed/open loop digital pre-distortion (DPD) and envelope tracking (ET) measurements taking just tens of milliseconds and overall measurement times less than 70 ms.
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PXI FPGA & Measurement Accelerator
Keysight PXI FPGA & measurement accelerator provide digital-pre-distortion (DPD) and envelope tracking (ET) measurements that are embedded in high performance FPGA processing cards.
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Solder Paste Wetting Tester
SP-2
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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3D Inline Solder Paste Inspection System
TROI 7700 SERIES
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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Solder Paste Printers
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Solder Cup Connector Kit
Y1141A
Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
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Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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Measurement
Vibration Meter
The input signal of the Vibration meter software, which is the output signal of the accelerometer, i.e. the vibrational acceleration signal, is filtered by means of one of four possible digital band filters. Then, based on this signal, vibrational velocity and displacement signals are calculated by means of integrating filters. Thus, the software generates three signals which are transferred to the ZETLAB data server virtual channels created by the program and having the word “Acceleration”, “Speed” or “Displacement” in their names, respectively.Signals are averaged for a selected time interval (0.1 s, 1 s, or 10 s), after which the obtained values are displayed in the dialog box elements of the Vibration meter program. It is possible to display a root-mean-square (RMS), average amplitude or peak value.
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Measurement
Tachometer
Tachometer is used for measuring the rotation frequency of shafts in machines and mechanisms, as well as for calculating the number of complete revolutions. Typically, for measuring the rotation frequency, optical or induction rpm sensors are used.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Power Measurement
An innovative product that provides better solution for power probing. Common DC power statistics including voltage, ampere and even the watt can be read instantly via NuDC-4U. Moreover, up to 4 sets of individual powers can be monitored simultaneously and the LCD screen can also display the maximum and minimum value of the current power during the test.
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Measurement Hardware
Whether it’s in a vehicle, on a test stand or monitoring equipment and machinery - imc data acquisition systems are easy to operate and will help you become more productive and profitable. Our products are suited for work in mechanical and mechatronic applications. They handle up to 100 kHz per channel, are compatible with almost all signal sources and sensors, and can measure nearly all physical quantities such as pressure, force, speed, vibration, noise, temperature, voltage and current. The spectrum of imc data acquisition systems ranges from simple data acquisition via integrated real-time calculations, to the integration of models and complete automation of test stands.
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Resistance Measurement
PROMET 100 / 200 / 600 high-accuracy, precision ohm meters deliver an adjustable test current up to 600 A which is independent of the supply voltage. They utilize the four-wire resistance measurement method, enabling them to meet extremely stringent accuracy requirements when determining resistance values in the micro-ohm range.State-of-the-art power electronics coupled with a robust design guarantee maximum reliability, even when used as portable devices in switching stations or industrial environments.The modern operating concept, an interface to the test systems of the ACTAS product line and an optional remote control unit make these micro-ohm meters flexible and versatile.
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Measurement
Site VSWR
The Site VSWR measurement is done according to CISPR 16-1-4 in the frequency range from 1 GHz to 18 GHz using broadband omni directional antennas in horizontal and vertical polarisation. The volumetric test method is applied (test volume needs to be specified), test distance 3 m - any other distance upon request. The ground plane has to be covered with absorbing material.
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*Terahertz Measurement
Terahertz laser power and beam profiling measurement is not a trivial task. But as anyone using or developing THz lasers knows, it is crucial to obtain accurate measurements of your laser. Ophir offers a few choices, depending on what aspect of your laser you need to measure. Read these posts for more about Terahertz measurement.
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Measurement Software
Revolutionary, industry-standard, easy-to-use 3D measurement software and CAD modules.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
