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- Pickering Interfaces Inc.
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PXI 5A Mux 8-Bank 5-Ch Isolated COM
40-651-014
This range of high density power multiplexer modules is suitable for switching inductive/capacitive loads up to 5A at 250VAC. It is available in the following 1-pole multiplexer formats: 1-bank 48-channel. 2-bank 24-channel. 4-bank 11-channel. 8-bank 5-channel.Connections are made via a front panel 50-way male D-type connector. Power multiplexer modules are intended for switching heavy AC or DC loads or for slaving up to large external relays, contactors and solenoids.
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COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Computer On Modules
COM Express Compact
Advantech COM-Express Compact includes Intel core i, Intel 5th Generation, Intel atom processor, which are all designed with low power consumption processors. They perform the same functions and same pin definitions as the COM-Express Basic module but with smaller board dimensions of 95 x 95 mm. And COM Express Compact series provide from Intel core i, Intel 5th Generation, Intel atom processors, and is the best solution for mobile applications.
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COM Express Type 6 Compact module
COMeT6-1100
The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an Intel® 11th Gen Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
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COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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COM Express Type 6 Prototyping Kit Based On Intel® 12th Gen Core™ I5-12600HE
COM Express Type 6 Alder Lake-P
The COM Express Type 6 Alder Lake-P is a powerful COM Express Type 6-based IoT solution development kit powered by Intel 12th Gen i5-12600HE 12-core (4 P-core + 8 E-core) SoC with integrated Intel Iris Xe GPU graphics (80 execution units) and comprehensive high speed interfaces.
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COM Express
COM Express defines standardized footprints and pin-outs for Computer-on-Modules. With the Revision 2.0, PICMG added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are available. The new Pin-out Type 10 in COM Express Revision 2.0 supports perfectly modules in the COM Express mini footprint (84x55 mm).
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COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor
CEM521
The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
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Multipurpose Debug Board
DB40 Debug Module
The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features: - Port 80/81 decoding for Power On Self Test (POST) via LPC - Interface to SPI Flash for BIOS update - Interface to Board Management Controller (BMC) for update - Power and Reset buttons and status LEDs The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this purpose. (Includes DB40 Debug Module, two 40-pin FFC cables, and 14-pin cable for SP100 DediProg USB to SPI programmer.)
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COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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COM Express Type 10 Mini Module With Intel® Atom™ E3800 Family
CEM846
The CEM846 COM Express type 10 Mini module is powered by the Intel® Atom™ processor E3800 family (codename: Bay Trail) with Intel® HD graphics (Gen 7with 4EU) engine. The CEM846 addresses the need for modular and small form factor computing platform that provides flexibility and scalability, and aimed at operating in an extended range of temperature. The computer on module is only 84mm x 55 mm form factor which supports onboard 4 GB DDR3L memory, wide voltage, rich I/O, and four lanes of PCle interfaces. From all these features together, the Intel® Atom™-based COM Express type 10 CPU module can be widely applied to IIoT (Industrial Internet of Things), medical, transportation, security, military, portable device and many more.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
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COM Express Type 10 Mini Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM311
The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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COM Express Type 10 Starter Kit Plus
COM Express Type 10 Starter Kit Plus
The COM Express Type 10 nanoX Starter Kit Plus consists of a COM Express Type 10 core module reference carrier board that provides two PCIe Mini Card slots, 2 RJ-45 LAN ports, 2x USB 3.0, 2x USB 2.0, 1x USB client, 2x DB-9 COM, 1x SD card socket, and Mic/Linein/ Line-out. ADLINK also provides additional development tools including a verified 10.1" LVDS panel (optional), power supply, thermal solution and cabling accessories.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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COM Express Type 2 Starter Kit
The Starter Kit consists of a COM Express Type 2 core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included.
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Computer On Module
COMET6-DEVKIT-460-I7
The COMET6-DEVKIT-460-I7 is designed for rapid testing and evaluation of WINSYSTEMS’ COM Express Type 6 processor modules. This DevKit ships with WINSYSTEMS’ COMET6-1185GRE-32IL module and 11th Gen Intel® CORE™ i7 UP3-Class embedded processor. The DevKit includes all essential components for quick and easy system setup so you can start programming right out of the box, reduce engineering and software development time, perform rapid product evaluation, design validation, and speed time to market.
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Mini-ITX SBC With Intel® Celeron® Processor N3350 & Pentium® Processor N4200, VGA, HDMI, LVDS, USB 3.0, PCI Express Mini Card Slot, M.2, And HD Audio
MANO310
*Intel® Celeron® N3350 & Pentium® N4200 (optional)*2 DDR3L SO-DIMM for up to 8GB of memory*1 PCI Express Mini Card slot and PCIe x1*4 USB 3.0 and 2 USB 2.0*1 SATA-600, 1 M.2 and 1 SDXC slot*6 COM supported*12 to 24 VDC*VGA, HDMI and LVDS with triple-view supported
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COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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COM Express Type 7 10GbE SFP+ Network Adapter Card
CEI-4x10G SFP+
- Support up to four 10GbE SFP+ interfaces- COM.0 R3.1 Type 7 compliant- Dedicated for Express-ID7
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Computer On Modules
COM Express Mini
Advantech COM Express Mini series boards includes Intel Core i, Intel 4th Generation, Intel Atom processor. With mere 84 x 55 mm in size, COM Mini series are the most compact COM modules and match all demands from Intel Core i, Intel 4th Generation, to Intel atom processor. COM Express Mini series is compliant with the COM Express Type 1/10 standard pin definition, and with a slight modification are able to commit with the existing COM Express carrier boards.
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COM Express Type 2
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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Qseven® Reference Carrier Board
Q7-BASE
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
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COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Fanless Embedded System With Intel® Core™ I7-6600U/i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LAN, 4 USB 3.0, 2 COM And PCI Express Mini Card Slot
eBOX560-500-FL
The eBOX560-500-FL is an Intel® Skylake-based fanless embedded system with compact size and full-featured I/O interface. To bring both excellent performance and ultra-low power consumption, the palm-sized embedded box PC is powered by the 6th generation Intel® Core™ i7-6600U or Celeron® 3955U processor (formally codename: Skylake). One 260-pin DDR4-2133 SO-DIMM socket with system memory up to 16 GB is available. The power efficient IP40 embedded system supports 12V DC input with screw-lock and features a user-friendly AT/ATX DIP switch. The compact eBOX560-500-FL is suitable for Industrial Internet of Things (IIoT) solutions, digital signage, retail equipment, smart factory automation, thin clients, industrial controller systems and many more.
